In March 2022, GlobalFoundries launched a new FotonixTM platform that integrates high-performance RF, digital CMOS and silicon photonic (SiPH) circuits on the same chip in a single chip, While utilizing the scale, efficiency and strict process control of 300mm chip production.
In areas such as data center interconnection, optical networking, photonic computing, Fiber to the Home (FTTH) and Co-packaged optics, GlobalFoundries has identified this innovative technology to meet the most pressing, complex and difficult challenges of today and tomorrow.
What's the next step in getting silicon photonics into the hands of manufacturers and end customers? Create an end-to-end ecosystem for silicon optics. It is critical to expand photonics technology in the market. GlobalFoundries said it was working with industry leaders in packaging, EDA tools and other key categories to provide assistance to its silicon photonics portfolio to create an end-to-end ecosystem that enables its customers to develop and manufacture innovative chips.
According to GlobalFoundries, Fabrinet is a provider of advanced optical packaging and precision optics, electro-mechanical and electronics manufacturing services for OEM of complex products, including optical communication components, modules and subsystems, automotive components, medical devices, industrial lasers and sensors. Fabrinet combined with GlobalFoundries expertise to achieve high-fiber count, passively aligned fiber arrays for input and output of light from silicon photonic chips. The development utilized Fabrinet's existing proven manufacturing technology for optical elements and components, as well as co-packaged optical devices, eliminating the need for transceivers by packaging silicon switching circuits with optical devices in modules or packages.
Using silicon photonics samples from GlobalFoundries and sharing its technology expertise, Fabrinet has now demonstrated fiber connection capabilities for a 90nm silicon photonics process.
The two companies are also working together to bring fiber connectivity to GlobalFoundries' 45nm platform technology, including Fotonix silicon photonic chips, and expect these technologies to be fully tested and certified by the end of 2022.
Backed by GlobalFoundries, Fabrinet's wafers with fibre-optic connections will fully meet Telcordia's industry standard by the end of 2022.
Silicon photonics are being hailed as a major breakthrough in silicon chip production. The process of taking highly advanced chips from production to production is extremely complex. This process starts with the availability of silicon and relies on an ecosystem that provides EDA tools, design suites, software, packaging innovations, testing tools, and other elements that lead to a complete silicon solution.
As silicon photons-based chips begin to be supplied in bulk later this year, the industry expects to see significant uptake in applications including: high-performance computing, optical quantum computing, artificial intelligence, telecommunications, networking, virtual and augmented reality, defense and aerospace.
Fabrinet offers a wide range of advanced optical and electro-mechanical capabilities throughout the manufacturing process, including process design and engineering, supply chain management, manufacturing, advanced packaging, integration, final assembly and testing. Fabrinet focuses on producing high complexity products in any combination and in any quantity. Fabrinet has engineering and manufacturing resources and facilities in Thailand, the United States, China, Israel and the United Kingdom.